Technology Pathfinding
Evaluated 200+ publications to identify technology directions and guide polymer hybrid bonding process development.
SEMICONDUCTOR R&D · ADVANCED PACKAGING
Xiaomei Shen, PhD
Materials Scientist & Semiconductor R&D Engineer
Advanced Packaging · Hybrid Bonding · Process Integration · Electronic Materials
Connecting materials, processes, structures and performance to develop reliable next-generation semiconductor packaging technologies.
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01 · PROFILE
Materials science meets
semiconductor integration.
Materials Science PhD from Imperial College London and R&D Senior Engineer at STATS ChipPAC, with experience in advanced packaging, polymer hybrid bonding and process development.
Strong background in process integration, design of experiments, materials characterization and failure analysis, with expertise in understanding material–process–structure–performance relationships for process optimization and reliability improvement.
02 · PROFESSIONAL EXPERIENCE
STATS ChipPAC
R&D Senior Engineer · Singapore
TECHNOLOGY DEVELOPMENT
Polymer Hybrid Bonding
Leading technology development spanning pathfinding, test vehicle design, DOE, process integration, simulation and cross-functional technology alignment.
Test Vehicle & DOE
Designed daisy-chain and four-point test vehicles, defined process flows and structures, and developed DOE plans for process-window development and optimization.
Process Integration
Developed hybrid bonding process flows involving lithography, PVD, Cu electroplating, CMP, plasma treatment, dicing and TCB.
Simulation
Performed ANSYS-based thermo-mechanical simulations to evaluate structural integrity and screen process and design solutions.
Cross-functional Collaboration
Worked with internal teams, research institutes, material suppliers and equipment vendors on simulation, material evaluation, process development and technology alignment.
Failure Analysis
Root-cause analysis of packaging material and interface defects to support process optimization, yield improvement and reliability enhancement.
Methodology & Metrology Development
Python Image Processing
Automated detection and quantification of pin offset, saw street quality and die offset from thousands of OM images, reducing manual analysis time by 99%.
Statistical Process Analysis
Applied JMP for SPC, Cpk and yield analysis, together with Monte Carlo simulation for process-variation assessment.
Metrology Development
Developed and standardized contact-angle and shear-strength measurement methods and work instructions.
Automated Reporting
Built a Python-based data-analysis and reporting workflow, reducing processing time from hours to seconds.
03 · PHD RESEARCH · ELECTRONIC MATERIALS & INTERCONNECTS
Imperial College London
PhD Researcher · Oct 2020 — Feb 2025 · Imperial Research Profile ↗
Supervisor
Prof. Christopher M. Gourlay
Research on low-temperature solder materials for electronic packaging, with emphasis on solidification, microstructure evolution, crystallography, interface reactions and solder-joint reliability.
1,000+ hours of hands-on SEM, EBSD and EDX experience.
Investigated Sn–Bi and In–Sn–Bi solder alloys, linking processing conditions with microstructure evolution and performance.
Applied in-situ high-temperature EBSD, time-lapse SEM, TEM diffraction and MATLAB-based MTEX.
Collaborated with Tokamak Energy on ultra-low-temperature In–Sn–Bi solder materials for prototype applications.
04 · PUBLICATIONS, AWARDS & CONFERENCES
Selected Publications
Characterization of Coating Behavior of Organic Dielectric Materials on Epoxy Mold Compound for Wafer-Level Fan-Out (WLFO) Packaging
IEEE Electronics Packaging Technology Conference (EPTC) · Abstract accepted
Eutectic orientation relationships in Sn-Bi solder
Journal of Alloys and Compounds · Vol. 1035 · 181339
DOI ↗In-situ investigation of discontinuous precipitation in Sn-Bi low temperature solders
Materialia · Vol. 43 · 102524
DOI ↗High-speed synchrotron X-ray imaging of glass foaming and thermal conductivity simulation
Acta Materialia · Vol. 189 · 85–92
DOI ↗Award & Conferences
AWARD
Acta Student Award 2025
Awarded for research on Sn-Bi low-temperature solders; selected for presentation at the TMS 2027 Annual Meeting.
Acta Student Award Recipients ↗EPTC 2026Oral Presentation
TMS 2027 Annual MeetingPresenting Author
05 · PATENTS & INNOVATION
Innovation in advanced semiconductor packaging.
Hybrid Bonding Technology
U.S. Patent Application Filed
Hybrid Bonding Technology
U.S. Patent Application Filed
Interconnect Technology
U.S. Patent Application Filed
06 · TECHNICAL SKILLS
Materials Characterization
SEM (BSE, EDX) · EBSD · FIB · TEM diffraction · DSC · OM
Data & Programming
Python · JMP · SPC · DOE · Cpk · Yield & defect analysis · Basic SQL
Simulation & Modeling
ANSYS · Monte Carlo simulation · Thermo-Calc
Engineering Tools
MATLAB · ImageJ · Avizo · CAD · OIM · TSL · Esprit
Equipment & Process
BESI pick-and-place (L1 & L2) · Shadow Moiré · Lithography · PVD · Electroplating
Advanced Packaging
2.5D/3D · Chiplets · Interposers · Fan-In/Fan-Out WLP · RDL · TSV/TGV/TMV · D2W/W2W · Hybrid Bonding
07 · EDUCATION
Imperial College London
DPhil · Materials Research
University of Birmingham
B.Eng. · Material Science and Technology · First Class Hons.
Beijing University of Chemical Technology
B.Eng. · Polymer Materials and Engineering